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Proceedings Paper

New type of x-ray-wafer image intensifier with CsI-CsI/MCP photocathodes: its design and assessment
Author(s): Shiming Xiang; Hong Zhao
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Paper Abstract

The article introduces a new type of x-ray wafer image intensifier with a double proximity focusing system, (Phi) 50 CsI-CsI/MCP photocathode, and a series of welding constructions of glass window or ceramic components with metal rings. This kind of x-ray image intensifier has been widely used in the field of medical diagnosis and industrial non-destructive detection by means of sophisticated portable x-ray diagnoscopes, featuring a number of satisfactory performances such as low x-ray dosage, miniature x-ray tube and power supply, high output brightness and good resolution, light weight, small volume, low cost, and easy operation without any condition constrained by working environment and illumination. In the paper, the authors have given a series of formulae to determine characteristic parameters of the device, i.e., the quantum detection efficiencies of both reflection mode (CsI/MCP) and transmission mode (glass window CsI/MCP) photocathode, the brightness conversion factor, and resolution. The relations of the mentioned parameters with the performances of constituent components, which include CsI photocathodes layer thickness, MCP bias angle and gain, phosphor screen conversion efficiency, and double proximity focusing distances, are also briefly analyzed. The analysis thought and methods mentioned in the paper have been successfully used for the optimal design and assessment work of our devices and shows that they have a good coincidence with experimental results.

Paper Details

Date Published: 1 April 1993
PDF: 6 pages
Proc. SPIE 1982, Photoelectronic Detection and Imaging: Technology and Applications '93, (1 April 1993); doi: 10.1117/12.142021
Show Author Affiliations
Shiming Xiang, Xi'an Institute of Applied Optics (China)
Hong Zhao, Xi'an Institute of Applied Optics (China)


Published in SPIE Proceedings Vol. 1982:
Photoelectronic Detection and Imaging: Technology and Applications '93

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