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Proceedings Paper

Residual stresses in deposited materials
Author(s): Jerome B. Cohen
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Paper Abstract

X-ray diffraction provides a means of measuring the residual stress tensor in films, their bonding to the substrates, yield stress, stress relaxation, and stress gradients, all without removal from the substrate. Examples of such studies are presented for interconnect material, sputtered film and epoxied layers.

These stresses often far exceed those of the same material in the bulk, even when they are microns thick. Grain boundary diffusion controls stress relaxation and, therefore, also film failure by void formation. There are no gradients through the thickness of interconnect material.

Paper Details

Date Published: 28 January 1993
PDF: 23 pages
Proc. SPIE 10267, Integrated Optics and Optoelectronics: A Critical Review, 1026704 (28 January 1993); doi: 10.1117/12.141413
Show Author Affiliations
Jerome B. Cohen, Northwestern Univ. (United States)


Published in SPIE Proceedings Vol. 10267:
Integrated Optics and Optoelectronics: A Critical Review
Ka Kha Wong; Manijeh Razeghi, Editor(s)

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