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Proceedings Paper

Applications of multichip modules to advanced avionics systems
Author(s): Peter L. Young
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Paper Abstract

As the speed of microelectronic circuits continues to increase, the propagation delay between the semiconductor chips on a conventional multilayer printed wiring board becomes a bottleneck for achieving higher system performance. One way to reduce the packaging delay is to package bare semiconductor dies on a multichip module (MCM). This approach has been successfully implemented on high performance mainframe and supercomputers. In the past several years, there have been many reports on advanced signal processor and fault tolerant computer modules using thin film metal/polyimide MCMs. However, there have been very few, if any, implementations on real avionics systems. In this talk, we will examined the reasons why MCM implementations have not taken off in avionics at present. In particular, we will discuss the relationship between cost and performance in MCM implementation. Performance requirements are defined in terms of wiring density, controlled impedance, high frequency operation, and reliability. Both the manufacturing cost and system cost will be examined. Finally, some future extension of the present MCM technology to optical and microwave applications will be discussed.

Paper Details

Date Published: 16 February 1993
PDF: 3 pages
Proc. SPIE 1788, Sources and Detectors for Fiber Communications, (16 February 1993); doi: 10.1117/12.141103
Show Author Affiliations
Peter L. Young, Boeing Defense & Space Group (United States)


Published in SPIE Proceedings Vol. 1788:
Sources and Detectors for Fiber Communications
Stephen D. Hersee, Editor(s)

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