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Proceedings Paper

Particle evaluation/control of the Ti/TiN barrier layer in BiCMOS processing
Author(s): Ping Wang; Bin Liu; Mike May; Mark Granum
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Paper Abstract

Snake/comb defect test structures and an in-line patterned wafer inspection system (Inspex) are very effective for monitoring, investigating, and controlling contamination in modern silicon wafer manufacturing. These techniques have been widely used in our wafer fabrication facility to monitor silicon wafer processing, and to diagnose device failures. In this paper, the methodology of using these techniques to evaluate and control Ti/TiN barrier layer particles is demonstrated. The correlation between these two techniques was studied. A defectivity control baseline for Ti/TiN deposition process was established using statistical analysis. New and improved preventative maintenance procedures were implemented based on the data from snake and Inspex monitors. As a result, the particle defectivity of the Ti/TiN sputtering process has been dramatically reduced in the Ti/TiN process. The column failures of BiCMOS fast SRAM devices have been reduced by approximately 30%, and the probe yield of the SRAM product line has increased by over 14%.

Paper Details

Date Published: 14 January 1993
PDF: 12 pages
Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); doi: 10.1117/12.139361
Show Author Affiliations
Ping Wang, Motorola, Inc. (United States)
Bin Liu, Motorola, Inc. (United States)
Mike May, Motorola, Inc. (United States)
Mark Granum, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 1802:
Microelectronics Manufacturing and Reliability
Barbara Vasquez; Anant G. Sabnis; Kenneth P. MacWilliams; Jason C.S. Woo, Editor(s)

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