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Proceedings Paper

Improving built-in product reliability through the efficient identification of nonrandom contamination events
Author(s): Carl Aspin
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Paper Abstract

Defects that occur during wafer manufacturing are the cause of extrinsic reliability failures. A major challenge of building-in product reliability is finding and eliminating the causes of defects as efficiently as possible. One approach to this problem is to use automatic patterned wafer inspection equipment to locate wafers in-process that have non-random patterns of defective die. Information leading to the identification of assignable causes of defects or contamination can be obtained by analyzing such wafers. A method for estimating the number of non-random defective die per wafer is described. The method is based on the failure of Poisson statistics to provide an accurate estimate of the observed visual yield if defects fall in systematic or clustered arrangements. An example is given in which this approach resulted in processing improvements that produced a two-fold reduction in product defect density during a ten week period.

Paper Details

Date Published: 14 January 1993
PDF: 9 pages
Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); doi: 10.1117/12.139360
Show Author Affiliations
Carl Aspin, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 1802:
Microelectronics Manufacturing and Reliability
Barbara Vasquez; Anant G. Sabnis; Kenneth P. MacWilliams; Jason C.S. Woo, Editor(s)

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