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Proceedings Paper

Strategy for continuous improvement in IC manufacturability, yield, and reliability
Author(s): Dean J. Dreier; Mark Berry; Phil Schani; Michael Phillips; Joe Steinberg; Gary DePinto
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Paper Abstract

Continual improvements in yield, reliability and manufacturability measure a fab and ultimately result in Total Customer Satisfaction. A new organizational and technical methodology for continuous defect reduction has been established in a formal feedback loop, which relies on yield and reliability, failed bit map analysis, analytical tools, inline monitoring, cross functional teams and a defect engineering group. The strategy requires the fastest detection, identification and implementation of possible corrective actions. Feedback cycle time is minimized at all points to improve yield and reliability and reduce costs, essential for competitiveness in the memory business. Payoff was a 9.4X reduction in defectivity and a 6.2X improvement in reliability of 256 K fast SRAMs over 20 months.

Paper Details

Date Published: 14 January 1993
PDF: 10 pages
Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); doi: 10.1117/12.139359
Show Author Affiliations
Dean J. Dreier, Motorola, Inc. (United States)
Mark Berry, Motorola, Inc. (United States)
Phil Schani, Motorola, Inc. (United States)
Michael Phillips, Motorola, Inc. (United States)
Joe Steinberg, Motorola, Inc. (United States)
Gary DePinto, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 1802:
Microelectronics Manufacturing and Reliability
Barbara Vasquez; Anant G. Sabnis; Kenneth P. MacWilliams; Jason C.S. Woo, Editor(s)

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