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Proceedings Paper

Example of the `upstream approach` methodology: an investigation of open-contact failures in ASIC devices
Author(s): Tam T. Le; R. R. Mitchell; Jen-Jiang J. Lee; C. E. Chen; Hoang Huy Hoang
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Paper Abstract

As the VLSI/ULSI device density is increasing, the number of interconnects also increases at a much larger scale. Consequently, more interconnect related failures are expectedly threatening the quality and reliability of the devices. However, with an appropriate methodology, manufacturing defects can be removed from the source, thus preventing any latent field failures. This approach requires a total teamwork between various engineering groups: failure analysis, test/product engineering, manufacturing, etc. The purpose of this paper is to demonstrate a proven success of the 'Upstream Approach': A direct and effective methodology in preventing process-induced failures.

Paper Details

Date Published: 14 January 1993
PDF: 5 pages
Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); doi: 10.1117/12.139341
Show Author Affiliations
Tam T. Le, SGS-Thomson Microelectronics (United States)
R. R. Mitchell, SGS-Thomson Microelectronics (United States)
Jen-Jiang J. Lee, SGS-Thomson Microelectronics (United States)
C. E. Chen, SGS-Thomson Microelectronics (United States)
Hoang Huy Hoang, SGS-Thomson Microelectronics (United States)


Published in SPIE Proceedings Vol. 1802:
Microelectronics Manufacturing and Reliability
Barbara Vasquez; Anant G. Sabnis; Kenneth P. MacWilliams; Jason C.S. Woo, Editor(s)

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