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Proceedings Paper

Hybrid integration of surface-emitting microlaser chip and planar optics substrate
Author(s): Juergen Jahns; Robert A. Morgan; Hung N. Nguyen; James A. Walker; Susan J. Walker; Yiu-May Wong
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Paper Abstract

A one-dimensional array of surface-emitting microlasers was bonded onto a glass substrate that contains a matching array of microlenses and mirrors. The bonding was achieved by solder bump bonding with indium being used as the solder material. The alignment precision is within +/- 2 micrometers. The optical substrate provides a simple interconnection scheme that routes the light from each laser to a well defined output position. The lenses are implemented as diffractive elements and are fabricated by lithography and dry etching.

Paper Details

Date Published: 13 January 1993
PDF: 5 pages
Proc. SPIE 1751, Miniature and Micro-Optics: Fabrication and System Applications II, (13 January 1993); doi: 10.1117/12.138903
Show Author Affiliations
Juergen Jahns, AT&T Bell Labs. (United States)
Robert A. Morgan, AT&T Bell Labs. (United States)
Hung N. Nguyen, AT&T Bell Labs. (United States)
James A. Walker, AT&T Bell Labs. (United States)
Susan J. Walker, AT&T Bell Labs. (United States)
Yiu-May Wong, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 1751:
Miniature and Micro-Optics: Fabrication and System Applications II
Chandrasekhar Roychoudhuri; Wilfrid B. Veldkamp, Editor(s)

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