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Proceedings Paper

Automated visual inspection of SMDs in an industrial environment
Author(s): Eam-Khwang Teoh; Dinesh P. Mital
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Paper Abstract

This paper presents the techniques used to inspect for defects on surface mount PCBs. Focusses were made on five different types of defects, namely, missing components, misalignment, wrong orientation of I.C. chips, wrong parts, and poor solder joints. Thus, five separate algorithms had been developed to detect these faults. The technique of windowing was employed to reduce the amount of redundant data to be processed. Preprocessing functions like convolution as well as all image processing tasks are performed on the window regions only, saving tremendously on computation time. Experimental results showed that these algorithms are reliable, fast, and cost-effective.

Paper Details

Date Published: 18 January 1993
PDF: 10 pages
Proc. SPIE 1713, International Conference on Manufacturing Automation, (18 January 1993); doi: 10.1117/12.138484
Show Author Affiliations
Eam-Khwang Teoh, Nanyang Technological Univ. (Singapore)
Dinesh P. Mital, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 1713:
International Conference on Manufacturing Automation
Anand Krishna Asundi; S. T. Tan, Editor(s)

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