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Proceedings Paper

High-performance 30 TDI scan reversible MWIR InSb hybrid scanning array with on-focal-plane dynamic-range compression
Author(s): Timothy F. Henricks; Thomas E. Wilson; D. Renee Bishop; James Halvis; Robert R. Shiskowski
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Paper Abstract

This paper details a high performance MWIR scanning array with 30 time delay and integration stages (TDI), forward and reverse scan operation, less than 80 noise electrons per stage, and on focal plane blooming control and dynamic range compression. The 92 column by 30 TDI device is fabricated using hybrid technology with the detector fabricated in InSb and indium bumped to a VLSI/CMOS/CCD silicon readout fabricated in 1.25 micrometers CMOS with two poly and three metal interconnect levels.

Paper Details

Date Published: 1 September 1992
PDF: 9 pages
Proc. SPIE 1685, Infrared Detectors and Focal Plane Arrays II, (1 September 1992); doi: 10.1117/12.137807
Show Author Affiliations
Timothy F. Henricks, Westinghouse Electric Corp. (United States)
Thomas E. Wilson, Westinghouse Electric Corp. (United States)
D. Renee Bishop, Westinghouse Electric Corp. (United States)
James Halvis, Westinghouse Electric Corp. (United States)
Robert R. Shiskowski, Westinghouse Electric Corp. (United States)


Published in SPIE Proceedings Vol. 1685:
Infrared Detectors and Focal Plane Arrays II
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

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