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Proceedings Paper

80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit
Author(s): Timothy Yale Wittwer; Daniel M. Chester; John Gonzales
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Paper Abstract

Hughes Aircraft Company has successfully demonstrated accurate, high-throughput, automated cryogenic wafer-level testing of a 64 X 64 readout integrated circuit (ROIC) for use in the Army's Advanced Anti-armor Weapon System-Medium (AAWS-M) program (contract #DAAH01-89-C-A012). Data acquired from our cryogenic wafer prober is compared to data acquired utilizing a standard 68-pin dewar. ROIC noise, transimpedance, transimpedance linearity, slew rate, data valid time, operating speed, and dynamic range test data are presented. Delivery system flow diagrams are presented to show the streamlining effect of cryogenic wafer probing on the ROIC test flow.

Paper Details

Date Published: 12 August 1992
PDF: 10 pages
Proc. SPIE 1683, Infrared Focal Plane Array Producibility and Related Materials, (12 August 1992); doi: 10.1117/12.137776
Show Author Affiliations
Timothy Yale Wittwer, Hughes Aircraft Co. (United States)
Daniel M. Chester, Hughes Aircraft Co. (United States)
John Gonzales, Hughes Aircraft Co. (United States)


Published in SPIE Proceedings Vol. 1683:
Infrared Focal Plane Array Producibility and Related Materials
Raymond S. Balcerak; Paul W. Pellegrini; Dean A. Scribner, Editor(s)

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