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Proceedings Paper

Novel surface imaging process with ion-beam lithography and dry development
Author(s): Ulrich A. Jagdhold; Wolfgang Pilz; L. M. Buchmann; M. Torkler
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Paper Abstract

A new resist processing is presented using the carbonization of organic polymer-based resists due to ion beam exposure and a following dry development under O2-RIE conditions. As an example for this process, a negative tone pattern transfer yielding a structure size down to 50 nm is demonstrated. The influence of the ion exposure dose and the O2-RIE conditions on the pattern transfer are discussed in this paper.

Paper Details

Date Published: 9 July 1992
PDF: 5 pages
Proc. SPIE 1671, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II, (9 July 1992); doi: 10.1117/12.136035
Show Author Affiliations
Ulrich A. Jagdhold, Institut fuer Halbleiterphysik Frankfurt (Germany)
Wolfgang Pilz, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)
L. M. Buchmann, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)
M. Torkler, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)


Published in SPIE Proceedings Vol. 1671:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II
Martin C. Peckerar, Editor(s)

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