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Proceedings Paper

Finite element analysis of dynamic thermal distortions of an x-ray mask for synchrotron radiation lithography
Author(s): Eric A. Haytcher; Roxann L. Engelstad; N. M. Schnurr
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Paper Abstract

This paper presents the transient modelling of an x-ray lithography mask undergoing continuous wave x-ray exposure. Two- and three-dimensional finite element models are developed to analyze the heat transfer mechanisms in the mask-wafer-holder assembly system. An additional structural model is used to calculate thermally-induced stresses and distortions (in-plane and out-of-plane) as a function of time. Parametric studies are performed to identify the effects of the Gaussian beam width, scanning frequency, exposure time and proximity gap setting on the dynamic response of the membrane.

Paper Details

Date Published: 9 July 1992
PDF: 10 pages
Proc. SPIE 1671, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II, (9 July 1992); doi: 10.1117/12.136019
Show Author Affiliations
Eric A. Haytcher, Univ. of Wisconsin/Madison (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
N. M. Schnurr, Los Alamos National Lab. (United States)


Published in SPIE Proceedings Vol. 1671:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II
Martin C. Peckerar, Editor(s)

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