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Proceedings Paper

Bump-bonded back-illuminated CCDs
Author(s): Michael P. Lesser; Ann Bauer; Lee Ulrickson; David B. Ouellette
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Paper Abstract

We have developed a thinning and packaging process which allows the conversion of front-illuminated charge-coupled devices (CCDs) into back illuminated sensors. This process does not depend on any special processing by the manufacturer and can therefore be used with any type of CCD. The process consists of several major steps which include: 1) making a silicon substrate with conductive traces and indium bumps which mate to the CCD wire bonding pads 2) placing indium bumps on the CCD wire bonding pads 3) bump bonding the substrate and CCD together 4) thinning 5)packaging 6) oxidizing the backside surface 7) applying antireflection coatings and 8) backside charging. Using this process with Loral 1200x800 and 3072x1024 CCDs we have produced devices with quantum efficiency in excess of 80 in the near-UV and visible wavelength regions. The surface flatness of these devices has been measured interferometrically to deviate from a plane by less than 1 um rms for the 1200x800 pixel sensors. 2.

Paper Details

Date Published: 12 August 1992
PDF: 9 pages
Proc. SPIE 1656, High-Resolution Sensors and Hybrid Systems, (12 August 1992); doi: 10.1117/12.135929
Show Author Affiliations
Michael P. Lesser, The Univ. of Arizona/Steward Observatory (United States)
Ann Bauer, The Univ. of Arizona/Steward Observatory (United States)
Lee Ulrickson, The Univ. of Arizona/Steward Observatory (United States)
David B. Ouellette, Multiple Mirror Telescope Observatory/The Univ. of Arizona (United States)


Published in SPIE Proceedings Vol. 1656:
High-Resolution Sensors and Hybrid Systems
Morley M. Blouke; Winchyi Chang; Laurence J. Thorpe; Rajinder P. Khosla, Editor(s)

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