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Proceedings Paper

Pad analysis system: a successful machine vision application for solder ball inspection
Author(s): Rainer Richter; Kathryn Barr Kirtley
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Paper Abstract

The pad analysis system (PAS) is an automated visual inspection system developed through a joint effort of the research and manufacturing divisions. It inspects wafers for low volume solder balls. Solder balls (also called pads or bumps) are used to join semiconductor chips to substrates. When low volume solder balls fail to join, there is a resulting open circuit defect. PAS is a cost effective method of providing customers with a high quality level. The solder ball manufacturing process, while providing excellent quality, is not capable of producing the levels needed by the sophisticated chips and modules used in mainframes. PAS also provides a benefit by increasing yield. Its increased accuracy reduces the overkill associated with manual inspection. PAS is also programmed with pad functionality information about which non- critical low volume pads can be safely shipped. This information is typically too complex to be implemented manually. PAS significantly reduces rework, generates labor savings, and even improves yield. The PAS is an example of both a productive collaboration and a successful technology transfer between research and manufacturing. It is also the story of incremental improvements in hardware, software, and function which allowed the system to inspect increasingly complex chips with decreased cycle time and reduced operator intervention.

Paper Details

Date Published: 1 November 1992
PDF: 12 pages
Proc. SPIE 1823, Machine Vision Applications, Architectures, and Systems Integration, (1 November 1992); doi: 10.1117/12.132079
Show Author Affiliations
Rainer Richter, IBM East Fishkill (United States)
Kathryn Barr Kirtley, IBM Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1823:
Machine Vision Applications, Architectures, and Systems Integration
Bruce G. Batchelor; Susan Snell Solomon; Frederick M. Waltz, Editor(s)

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