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Proceedings Paper

Conceptual monolithic pad grid array connector for transducer interconnects
Author(s): Scott S. Corbett; Robert F. Stanton
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Paper Abstract

In this paper we describe and demonstrate a unique termination scheme whereby an array of coaxial wires is efficiently fabricated into a monolithic substrate resulting in a two-dimensional array structure forming a pad grid array connector. This structure has significant implications for high density cable interconnect applications in ultrasound transducer systems, circuit board and hybrid interconnect structures. A connector concept is proposed in which the interconnect is used as an in-line connector for a user-friendly transducer probe interconnect system. Future applications of the connector are described including use as an integrated substrate onto which both one and two-dimensional arrays can be fabricated or connected. Results including electrical testing are shown for a 12.7 mm (0.5') diameter, 100 position, 0.6 mm (.25') center-to-center rectilinear pad array connector utilizing 40 gauge 50 (Omega) coaxial wires.

Paper Details

Date Published: 5 November 1992
PDF: 11 pages
Proc. SPIE 1733, New Developments in Ultrasonic Transducers and Transducer Systems, (5 November 1992); doi: 10.1117/12.130603
Show Author Affiliations
Scott S. Corbett, Precision Interconnect Corp. (United States)
Robert F. Stanton, Precision Interconnect Corp. (United States)

Published in SPIE Proceedings Vol. 1733:
New Developments in Ultrasonic Transducers and Transducer Systems
Frederick L. Lizzi, Editor(s)

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