Share Email Print
cover

Proceedings Paper

Conceptual monolithic pad grid array connector for transducer interconnects
Author(s): Scott S. Corbett; Robert F. Stanton
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper we describe and demonstrate a unique termination scheme whereby an array of coaxial wires is efficiently fabricated into a monolithic substrate resulting in a two-dimensional array structure forming a pad grid array connector. This structure has significant implications for high density cable interconnect applications in ultrasound transducer systems, circuit board and hybrid interconnect structures. A connector concept is proposed in which the interconnect is used as an in-line connector for a user-friendly transducer probe interconnect system. Future applications of the connector are described including use as an integrated substrate onto which both one and two-dimensional arrays can be fabricated or connected. Results including electrical testing are shown for a 12.7 mm (0.5') diameter, 100 position, 0.6 mm (.25') center-to-center rectilinear pad array connector utilizing 40 gauge 50 (Omega) coaxial wires.

Paper Details

Date Published: 5 November 1992
PDF: 11 pages
Proc. SPIE 1733, New Developments in Ultrasonic Transducers and Transducer Systems, (5 November 1992); doi: 10.1117/12.130603
Show Author Affiliations
Scott S. Corbett, Precision Interconnect Corp. (United States)
Robert F. Stanton, Precision Interconnect Corp. (United States)


Published in SPIE Proceedings Vol. 1733:
New Developments in Ultrasonic Transducers and Transducer Systems
Frederick L. Lizzi, Editor(s)

© SPIE. Terms of Use
Back to Top