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Proceedings Paper

Automated vision system for inspection of wedge bonds
Author(s): Koduri K. Sreenivasan; Mandayam D. Srinath; Alireza R. Khotanzad
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Paper Abstract

One of the problems in increasing reliability in the manufacture of integrated circuit devices is inspection of the bonds connecting the bond pads to the lead fingers to the device. The continuing increase in packing density of VLSI circuits requires that the inspection process be completely automated. Here we present a method for visual inspection of bonds which is intended to automatically extract parameters of significance in determining their quality froni two-dimensional images taken from the top of the IC wafer.

Paper Details

Date Published: 1 August 1992
PDF: 6 pages
Proc. SPIE 1661, Machine Vision Applications in Character Recognition and Industrial Inspection, (1 August 1992); doi: 10.1117/12.130306
Show Author Affiliations
Koduri K. Sreenivasan, Southern Methodist Univ. (United States)
Mandayam D. Srinath, Southern Methodist Univ. (United States)
Alireza R. Khotanzad, Southern Methodist Univ. (United States)


Published in SPIE Proceedings Vol. 1661:
Machine Vision Applications in Character Recognition and Industrial Inspection
Donald P. D'Amato; Wolf-Ekkehard Blanz; Byron E. Dom; Sargur N. Srihari, Editor(s)

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