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Proceedings Paper

Advanced Via Inspection Tool
Author(s): Douglas Y. Kim; Kurt Muller; Lawrence D. Thorp; Kenneth A. Bird
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Paper Abstract

The AVIT inspects vias on unfired ceramic layers used in microelectronic packaging for paste fill depth spacing and size. Four shadow images from different angles and one vertical image determine the fill status of 100 89um vias in the area of 160mm by 160mm. Each via is filled with a conductive paste. The cycle time to inspect a greensheet is 3. 75 seconds. The paste depth is determined by the area of shadow given by each oblique direction. The greater area of shadow is used to determine via depth. In order to achieve the cycle time of 3. 75 seconds we incorporate a laser scanner rotating at 28 rpm telecentric scan lens and dedicated signal processing one of the electronic racks uses ECL running at 87 MHz. The other electronics are predominant Fast-TTL.

Paper Details

Date Published: 1 August 1992
PDF: 15 pages
Proc. SPIE 1661, Machine Vision Applications in Character Recognition and Industrial Inspection, (1 August 1992); doi: 10.1117/12.130305
Show Author Affiliations
Douglas Y. Kim, IBM/East Fishkill Facility (United States)
Kurt Muller, IBM/East Fishkill Facility (United States)
Lawrence D. Thorp, IBM/East Fishkill Facility (United States)
Kenneth A. Bird, IBM/East Fishkill Facility (United States)

Published in SPIE Proceedings Vol. 1661:
Machine Vision Applications in Character Recognition and Industrial Inspection
Donald P. D'Amato; Wolf-Ekkehard Blanz; Byron E. Dom; Sargur N. Srihari, Editor(s)

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