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Optical Engineering

Resist Technology For Submicrometer Optical Lithography
Author(s): W. R. Brunsvold; D. M. Crockatt; G. J. Hefferon; C. F. Lyons
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Paper Abstract

This paper reviews the impact of advances in photoresists and processing on submicrometer imaging using optical lithography. Among the topics discussed for the extension of single-layer resists into the submicrometer regime are the use of dyes, the development of materials for the deep-UV region, image reversal, and contrast-enhancement layers. Approaches to dealing with substrate topographical effects, such as multilayer resists and antireflection coatings, are reviewed. Future directions to extend optical lithography further and address current problems are discussed.

Paper Details

Date Published: 1 April 1987
PDF: 7 pages
Opt. Eng. 26(4) 264330 doi: 10.1117/12.7974075
Published in: Optical Engineering Volume 26, Issue 4
Show Author Affiliations
W. R. Brunsvold, IBM East Fishkill (United States)
D. M. Crockatt, IBM East Fishkill (United States)
G. J. Hefferon, IBM East Fishkill (United States)
C. F. Lyons, IBM East Fishkill (United States)

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