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Optical Engineering

Excimer Laser Based Lithography: A Deep-Ultraviolet Wafer Stepper For VLSI Processing
Author(s): Victor Pol; James H. Bennewitz; Tanya E. Jewell; Darryl W. Peters
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Paper Abstract

A deep-ultraviolet step-and-repeat system, operating at 248.4 nm, has been developed by retrofitting a commercial lithography tool with a KrF excimer laser and custom designed, fused silica condenser and projection optics. It is a reduction system with a field size of 14.5 mm and a variable numerical aperture of 0.20 to 0.38. Resolution of 0.5 µm features over the full field is obtained with routine use, and 0.35 µm resolution is attainable under more limited conditions. This paper describes the development and testing of the system, including recent modifications, and discusses some of the technical issues associated with short wavelength excimer laser based lithography.

Paper Details

Date Published: 1 April 1987
PDF: 8 pages
Opt. Eng. 26(4) 264311 doi: 10.1117/12.7974072
Published in: Optical Engineering Volume 26, Issue 4
Show Author Affiliations
Victor Pol, AT&T Bell Laboratories (United States)
James H. Bennewitz, AT&T Bell Laboratories (United States)
Tanya E. Jewell, AT&T Bell Laboratories (United States)
Darryl W. Peters, AT&T Bell Laboratories (United States)

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