Share Email Print

Optical Engineering

Infrared Imaging Study Of Print Head Temperatures Occurring During Resistive Ribbon Thermal Transfer Printing
Author(s): S. I. Tan; R. Lane; D. B. Dove
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

An infrared imaging system has been used to measure the thermal response of the print head electrodes during resistive ribbon thermal transfer printing. This has proved to be an effective method for fast, non-contact, high spatial resolution temperature measurements, providing valuable information on the thermal stress upon the head materials and on the amount of energy flowing into the head during printing.

Paper Details

Date Published: 1 November 1986
PDF: 5 pages
Opt. Eng. 25(11) 251217 doi: 10.1117/12.7973985
Published in: Optical Engineering Volume 25, Issue 11
Show Author Affiliations
S. I. Tan, IBM Thomas J. Watson Research Center (United States)
R. Lane, IBM Thomas J. Watson Research Center (United States)
D. B. Dove, IBM Thomas J. Watson Research Center (United States)

© SPIE. Terms of Use
Back to Top