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Optical Engineering

Sandwich Holospeckle Interferometry For Three-Dimensional Displacement Determination
Author(s): X. P. Wu; F. P. Chiang
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Paper Abstract

A holospeckle technique for 3D displacement measurement using sandwich plates is developed, whereby the resulting fringes have a variable sensitivity in both the hologram and specklegram modes.

Paper Details

Date Published: 1 June 1986
PDF: 2 pages
Opt. Eng. 25(6) doi: 10.1117/12.7973898
Published in: Optical Engineering Volume 25, Issue 6
Show Author Affiliations
X. P. Wu, State University of New York at Stony Brook (United States)
F. P. Chiang, State University of New York at Stony Brook (United States)


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