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Optical Engineering

High Speed Macrophotography Used in Semiconductor Manufacturing
Author(s): Paul C. Pfeiffer
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Paper Abstract

Discussed are the methods used in photographing contaminate particles of less than .006" size inside transistors while subjected to various frequencies and vibrations. Observation of wire forming dies and electrode welding of header posts in automatic equipment and a suggested method of adapting a microscope into a camera taking lens.

Paper Details

Date Published: 1 January 1966
PDF: 3 pages
Opt. Eng. 4(2) 040255 doi: 10.1117/12.7971347
Published in: Optical Engineering Volume 4, Issue 2
Show Author Affiliations
Paul C. Pfeiffer, Texas Instruments, Inc. (United States)


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