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Optical Engineering

Transient thermal stress analysis of interacting surface defects by digital photoelasticity
Author(s): Wei-Chung Wang; Tsai-Lin Chen
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Paper Abstract

The digital photoelastic technique was used to obtain an experimental solution of the transient thermal stresses of two interacting semielliptic surface defects due to a step temperature change at the free surface. A series of computer programs were developed on the digital photoelastic system to extract the maximum transient thermal stress on the defect boundary. By using a statistical analysis package, the variation of the maximum transient thermal stresses and their locations were correlated with the time, temperature difference, and geometrical parameters of the defects.

Paper Details

Date Published: 1 January 1992
PDF: 12 pages
Opt. Eng. 31(1) doi: 10.1117/12.56044
Published in: Optical Engineering Volume 31, Issue 1
Show Author Affiliations
Wei-Chung Wang, National Tsing Hua Univ. (Taiwan)
Tsai-Lin Chen, Industrial Technology Research Institute (Taiwan)

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