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Optical Engineering

The Color-Box alignment vernier: a sensitive lithographic alignment vernier read at low magnification
Author(s): Peter A. Heimann
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Paper Abstract

A lithographic alignment vernier based on low-magnification imaging of line-space patterns has been developed. Its resolution is limited only by the lithographic process used; a vernier that can be interpolated to 1/16 µm is demonstrated, using step-and-repeat optical lithography. This vernier can be read quickly and easily because it is read at low magnification, where there are no problems with depth of focus, even for multilevel resists. The vernier is tolerant to variations in linewidth, resist thickness, and edge profile. A machine-readable version of this vernier is also described.

Paper Details

Date Published: 1 July 1990
PDF: 9 pages
Opt. Eng. 29(7) doi: 10.1117/12.55649
Published in: Optical Engineering Volume 29, Issue 7
Show Author Affiliations
Peter A. Heimann, AT&T Bell Labs. (United States)


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