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Optical Engineering

Packaging and performance of a high-speed indium phosphide access switch
Author(s): Rainer K. Baettig; Mark Fitzpatrick; Olivier Anthamatten; Bernd Valk
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Paper Abstract

The assembly of optoelectronic devices in their bare chip form into fully functional modules and the performance of a 1 x 2 optical space switch, combined with a dedicated high-speed digital-driver integrated circuit, is reported. The specifications of the packaged module closely approach the data on the unpackaged devices. The peak digital modulation rate of the switch is 1.5 Gbit/s, a performance compatible with many broadband uses. Successful testing in a system test bed demonstrates the usefulness of the realized module from an application point of view. High-speed optoelectronic assembly technology without performance degradation requires a number of packaging skills. These include rugged submicron-accuracy fiber fixing, suitable microwave electronic interconnections, and appropriate thermal-load management

Paper Details

Date Published: 1 September 1995
PDF: 5 pages
Opt. Eng. 34(9) doi: 10.1117/12.205678
Published in: Optical Engineering Volume 34, Issue 9
Show Author Affiliations
Rainer K. Baettig, Ascom Tech Ltd. (Switzerland)
Mark Fitzpatrick, Ascom Tech AG (Switzerland)
Olivier Anthamatten, Ascom Tech AG (Switzerland)
Bernd Valk, Ascom Tech AG (Switzerland)

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