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Optical Engineering

Packing density and interconnection length of a highly parallel optical interconnect using polymer-based, single-mode bus arrays
Author(s): Suning Tang; Ray T. Chen; Mark A. Peskin
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Paper Abstract

Interconnection length and packing density are important parameters in channel-waveguide-based photonic integrated circuits. A multiple-channel crosstalk model is developed and then applied, together with experimental results, to study the minimum bus separation and maximum bus length in a highly parallel single-mode bus array (SMBA) to be used for inter-MCM (multi-chip-module) optoelectronic interconnects. Further investigation of the trade-off between packing density and interconnection length resulting from channel cross coupling provides a rule of thumb for an optimized bus array design. For a given waveguide and cladding index, it is found that waveguide dimensions should be close to the cutoff dimensions of the second-mode to obtain an optimal wave confinement factor. The maximum packing density of an SMBA using coherent light sources is shown to be different from that using incoherent light sources. An example using as criteria an extinction ratio of 20, 1-dB power penalty, and a bit error rate (BER) of 10-15 is presented. It is shown that the packing density of a polymer-based SMBA ranges from 300 to 750 channels/cm for coherent light sources and from 400 to 950 channels/cm for incoherent light sources with a bus length of 2.0 cm, a core index n1 = 1.5, and index difference from 0.015 to 0.0015. Further experimental work is conducted to confirm the accuracy of the presented theory.

Paper Details

Date Published: 1 May 1994
PDF: 6 pages
Opt. Eng. 33(5) doi: 10.1117/12.166525
Published in: Optical Engineering Volume 33, Issue 5
Show Author Affiliations
Suning Tang, Univ. of Texas/Austin (United States)
Ray T. Chen, Univ. of Texas/Austin (United States)
Mark A. Peskin, Univ. of Texas/Austin (United States)


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