Share Email Print
cover

Optical Engineering

Chemical amplification positive deep ultraviolet resist by means of partially tetrahydropyranyl-protected polyvinylphenol
Author(s): Takashi Hattori; Leo Schlegel; Akira Imai; Nobuaki Hayashi; Takumi Ueno
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

Chemical amplification positive resists using tetrahydropyranyl-protected polyvinylphenol (THP-M) are investigated for deep-UV lithography. Infrared spectroscopy meansurements show that THP-M in the resist film cannot be completely deprotected by photogenerated acid. This causes a poor developability of the resist containing highly tetrahydropyranyl (THP) protected polyvinylphenol in an aqueous base developer. To improve the developability in the pure aqueous base developer, we use partially THP-protected polyvinylphenol. To determine the optimum protection degree, we examine the relation between the dissolution rate of THP-M films and THP-protection degree in developers. A resist formulated from 20% THP-protected polyvinylphenol and bis(tert-butylphenyl)iodonium triflate resolved 0.30-μm line-and-space patterns with the aqueous base development using a KrF excimer laser stepper with a dose of 46 mJ/cm2. Postexposure delay effects of this resist system are also studied. The deprotection reaction of THP-M for lower dose during the holding time at room temperature and incomplete deprotection reaction for higher dose are found to deteriorate the exposure characteristics.

Paper Details

Date Published: 1 October 1993
PDF: 8 pages
Opt. Eng. 32(10) doi: 10.1117/12.145971
Published in: Optical Engineering Volume 32, Issue 10
Show Author Affiliations
Takashi Hattori, Hitachi, Ltd. (Japan)
Leo Schlegel, Hitachi, Ltd. (Japan)
Akira Imai, Hitachi, Ltd. (Japan)
Nobuaki Hayashi, Hitachi, Ltd. (Japan)
Takumi Ueno, Hitachi, Ltd. (Japan)


© SPIE. Terms of Use
Back to Top