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Optical Engineering

Suppression of backside damage in nanosecond internal-focusing pulse laser dicing with wavefront modulation
Author(s): Yu Takiguchi; Masaki Oyaizu; Makoto Nakano; Takashi Inoue; Haruyoshi Toyoda
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Paper Abstract

Laser dicing with tightly focused nanosecond pulsed laser light inside a semiconductor wafer is a dry, debris-free dicing method achieved by the generation of thermal microcracks. This method has two practical issues: a dicing speed that is limited by the repetition rate of the pulsed laser and potential damage to integrated circuits on the wafer from excessive laser intensity due to insufficient beam divergence. By correcting aberrations and generating multiple beams via wavefront modulation, multiple focused beams inside the wafer will become sufficiently divergent to avoid undesirable potential laser damage. We confirmed these improvements by dicing sapphire wafers with a pulsed laser and a high-numerical-aperture objective lens.

Paper Details

Date Published: 20 July 2017
PDF: 7 pages
Opt. Eng. 56(7) 077109 doi: 10.1117/1.OE.56.7.077109
Published in: Optical Engineering Volume 56, Issue 7
Show Author Affiliations
Yu Takiguchi, Hamamatsu Photonics K.K. (Japan)
Masaki Oyaizu, Hamamatsu Photonics K.K. (Japan)
Makoto Nakano, Hamamatsu Photonics K.K. (Japan)
Takashi Inoue, Hamamatsu Photonics K.K. (Japan)
Haruyoshi Toyoda, Hamamatsu Photonics K.K. (Japan)


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