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Optical Engineering

Laser three-dimensional printing microchannel heat sink for high-power diode laser array
Author(s): Guannan Jia; Yuntao Qiu; Anru Yan; Shun Yao; Zhiyong Wang
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Paper Abstract

To improve the heat management of high-power diode lasers, a microchannel heat sink is obtained, whose structure is optimized in method of numerical simulation. Following such a design, the microchannel heat sink is fabricated by nickel-based doping rare earth materials by laser three-dimensional (3-D) printing procedure. Since the noncorrosion property of such material has been preliminarily demonstrated by salt spray test, there is no necessity to plate the interior of the laser 3-D printing microchannel heat sink with gold. The coefficient of thermal expansion of such material is 11  ppm/K. The diode laser array (LDA) with 80-W cw output power, 2-mm cavity length, 100-μm emitter width, and 20% fill-factors is mounted on it for the thermal resistance test, and the result is 0.40  K/W. Moreover, the smile effect of the mounted LDA is merely 0.8  μm.

Paper Details

Date Published: 8 September 2016
PDF: 8 pages
Opt. Eng. 55(9) 096105 doi: 10.1117/1.OE.55.9.096105
Published in: Optical Engineering Volume 55, Issue 9
Show Author Affiliations
Guannan Jia, Beijing Univ. of Technology (China)
Yuntao Qiu, Beijing Univ. of Technology (China)
Anru Yan, Beijing Univ. of Technology (China)
Shun Yao, Beijing Univ. of Technology (China)
Zhiyong Wang, Beijing Univ. of Technology (China)


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