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Optical Engineering • Open Access

Mechanism analysis on finishing of reaction-sintered silicon carbide by combination of water vapor plasma oxidation and ceria slurry polishing
Author(s): Xinmin Shen; Qunzhang Tu; Hui Deng; Guoliang Jiang; Kazuya Yamamura

Paper Abstract

Reaction-sintered silicon carbide (RS-SiC), which is considered as a promising mirror material for space telescope systems, requires a high surface property. An ultrasmooth surface with a Ra surface roughness of 0.480 nm was obtained after water vapor plasma oxidation for 90 min followed by ceria slurry polishing for 40 min. The oxidation process of RS-SiC by water vapor plasma was analyzed based on the Deal–Grove model, and the theoretical calculation results are consistent with the measured data obtained by scanning white light interferometer (SWLI), scanning electron microscopy/energy-dispersive x-ray, and atomic force microscope. The polishing process of oxidized RS-SiC by ceria slurry was investigated according to the Preston equation, which would theoretically forecast the evolutions of RS-SiC surfaces along with the increasing of polishing time, and it was experimentally verified by comparing the surface roughnesses obtained by SWLI and the surface morphologies obtained by SEM. The mechanism analysis on the finishing of RS-SiC would be effective for the optimization of water vapor plasma oxidation parameters and ceria slurry polishing parameters, which will promote the application of RS-SiC substrates by improving the surface property obtained by the oxidation-assisted polishing method.

Paper Details

Date Published: 22 May 2015
PDF: 8 pages
Opt. Eng. 54(5) 055106 doi: 10.1117/1.OE.54.5.055106
Published in: Optical Engineering Volume 54, Issue 5
Show Author Affiliations
Xinmin Shen, The PLA Univ. of Science and Technology (China)
Qunzhang Tu, The PLA Univ. of Science and Technology (China)
Hui Deng, Osaka Univ. (Japan)
Guoliang Jiang, The PLA Univ. of Science and Technology (China)
Kazuya Yamamura, Osaka Univ. (Japan)

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