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Optical Engineering • Open Access

Mid-infrared integrated optics: versatile hot embossing of mid-infrared glasses for on-chip planar waveguides for molecular sensing
Author(s): Angela B. Seddon; Nabil S. Abdel-Moneim; Lian Zhang; Wei J. Pan; David Furniss; Christopher J. Mellor; Tomas Kohoutek; Jiri Orava; Tomas Wagner; Trevor M. Benson

Paper Abstract

The versatility of hot embossing for shaping photonic components on-chip for mid-infrared (IR) integrated optics, using a hard mold, is demonstrated. Hot embossing

Paper Details

Date Published: 4 June 2014
PDF: 10 pages
Opt. Eng. 53(7) 071824 doi: 10.1117/1.OE.53.7.071824
Published in: Optical Engineering Volume 53, Issue 7
Show Author Affiliations
Angela B. Seddon, The Univ. of Nottingham (United Kingdom)
Nabil S. Abdel-Moneim, The Univ. of Nottingham (United Kingdom)
Lian Zhang, The Univ. of Nottingham (United Kingdom)
Wei J. Pan, The Univ. of Nottingham (United Kingdom)
David Furniss, The Univ. of Nottingham (United Kingdom)
Christopher J. Mellor, The Univ. of Nottingham (United Kingdom)
Tomas Kohoutek, Univ. Pardubice (Czech Republic)
Jiri Orava, Univ. Pardubice (Czech Republic)
Tohoku Univ. (Japan)
Univ. of Cambridge (United Kingdom)
Tomas Wagner, Univ. Pardubice (Czech Republic)
Trevor M. Benson, The Univ. of Nottingham (United Kingdom)


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