Share Email Print
cover

Optical Engineering

Three-dimensional modeling and simulation of large-format hybrid indium antimonide detector arrays
Author(s): Li-Wen Zhang; Ming Shao; Xiao-Ling Zhang; Qing-Duan Meng; Jin-Chan Wang; Yanqiu Lv
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Infrared sensors, such as indium antimonide (InSb) detectors, are generally required to be cooled to 77 K in operation. High fracture probability under thermal shock, especially in large InSb infrared focal plane arrays (IRFPAs), limits their applicability. It is necessary to establish a realistic three-dimensional (3-D) structural model of large-format InSb IRFPAs. However, few data are available on 3-D high-fidelity structural modeling and simulation of large IRFPAs due to their complicated structure and huge meshing numbers. A simple equivalent modeling method had been used in our early works, which could reduce meshing numbers, but did not consider the complicated structure, and also brought a new problem that the equivalent outer region of the model was not consistent with the actual IRFPAs. To solve the problems, an improved equivalent modeling method is proposed, where a small-format array is first split into two parts and then employed to equivalently replace the real large-format array. A 3-D high-fidelity structural model of large-format hybrid InSb IRFPAs is developed; here, a 32×32 array is adopted to replace the real 128×128 array. The results show that the simulated stress and strain distribution characteristics of InSb chip are well in agreement with the fracture photograph of actual 128×128 InSb IRFPAs in testing, verifying the validity and feasibility of the 3-D structural model of large-format IRFPAs. All these are beneficial to further explore fracture mechanisms and improve the reliability of large-format hybrid InSb IRFPAs.

Paper Details

Date Published: 15 October 2013
PDF: 8 pages
Opt. Eng. 52(10) 103110 doi: 10.1117/1.OE.52.10.103110
Published in: Optical Engineering Volume 52, Issue 10
Show Author Affiliations
Li-Wen Zhang, Henan Univ. of Science and Technology (China)
Ming Shao, People's Liberation Army (China)
Xiao-Ling Zhang, Henan Univ. of Science and Technology (China)
Qing-Duan Meng, Henan Univ. of Science and Technology (China)
Jin-Chan Wang, Henan Univ. of Science and Technology (China)
Yanqiu Lv, Luoyang Institute of Electro-Optical Equipment (China)


© SPIE. Terms of Use
Back to Top