Share Email Print
cover

Optical Engineering

Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment
Author(s): Yong Jiang; Chengsi Luo; Chunming Liu; Xia Xiang; Xiaotao Zu; Xiaodong Yuan; Shaobo He; Wanguo Zheng; Haijun Wang; Haibing Lv; Wei Ren
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

Damage sites as large as 600 μm in fused silica surface were successfully mitigated with a new protocol by hydrofluoric acid (HF) etching combined with carbon dioxide laser treatment. The damage sites were first etched in 40% HF solution to blunt the fractures, and then the etched damage sites were smoothed with a CO2 laser. It has been found that the etching rate of damaged material in the lateral direction is larger than in the longitudinal direction; thus, an optimized etching time was chosen to etch the damage sites based on the etching ratio. Three types of damage test methods were used to confirm the mitigation efficiency of the protocol. The results indicate that the damage resistance capability of mitigated sites can recover to the level of pristine substrate.

Paper Details

Date Published: 2 August 2012
PDF: 7 pages
Opt. Eng. 51(8) 084301 doi: 10.1117/1.OE.51.8.084301
Published in: Optical Engineering Volume 51, Issue 8
Show Author Affiliations
Yong Jiang, Univ. of Electronic Science and Technology of China (China)
Chengsi Luo, Univ. of Electronic Science and Technology of China (China)
Chunming Liu, Univ. of Electronic Science and Technology of China (China)
Xia Xiang, Univ. of Electronic Science and Technology of China (China)
Xiaotao Zu, Univ. of Electronic Science and Technology of China (China)
Xiaodong Yuan, China Academy of Engineering Physics (China)
Shaobo He, China Academy of Engineering Physics (China)
Wanguo Zheng, China Academy of Engineering Physics (China)
Haijun Wang, China Academy of Engineering Physics (China)
Haibing Lv, China Academy of Engineering Physics (China)
Wei Ren, China Academy of Engineering Physics (China)


© SPIE. Terms of Use
Back to Top