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Optical Engineering

Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board
Author(s): Sung Hwan Hwang; Woo-Jin Lee; Myoung Jin Kim; Eun Joo Jung; Gye Won Kim; Jong Bae An; Byung Sup Rho; Ki Young Jung; Kyung Soon Cha
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Paper Abstract

We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70×8×0.25  mm. The completed active module has features of thinness (0.5 mm), small size (7×5  mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).

Paper Details

Date Published: 25 July 2012
PDF: 6 pages
Opt. Eng. 51(7) 075402 doi: 10.1117/1.OE.51.7.075402
Published in: Optical Engineering Volume 51, Issue 7
Show Author Affiliations
Sung Hwan Hwang, Korea Photonics Technology Institute (Korea, Republic of)
Woo-Jin Lee, Korea Photonics Technology Institute (Korea, Republic of)
Myoung Jin Kim, Korea Photonics Technology Institute (Korea, Republic of)
Eun Joo Jung, Korea Photonics Technology Institute (Korea, Republic of)
Gye Won Kim, Korea Photonics Technology Institute (Korea, Republic of)
Jong Bae An, Korea Photonics Technology Institute (Korea, Republic of)
Byung Sup Rho, Korea Photonics Technology Institute (Korea, Republic of)
Ki Young Jung, NewFlex Technology Co., Ltd. (Korea, Republic of)
Kyung Soon Cha, NewFlex Technology Co., Ltd. (Korea, Republic of)


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