Share Email Print
cover

Optical Engineering

Dual-prism coupler for board-level free-space optical interconnects: design and simulations
Author(s): Rohit Nair; Keith W. Goossen; Michael W. Haney
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

An optical design for coupling light from off-chip lasers to on-chip surface-normal modulators is proposed in order to implement chip-to-chip free-space optical interconnects. The method uses a dual-prism module constructed from prisms made of two different glasses. The various alignment tolerances of the proposed system were investigated. For the off-chip lasers, vertical cavity surface emitting lasers (VCSEL) are proposed. The rationale behind using on-chip modulators rather than VCSELs is to avoid VCSEL thermal loads on the chip, and because of higher reliability of modulators than VCSELs. Particularly above 10  Gbit/sec (Gbit/sec⁡), an empirical model shows rapid decrease of VCSEL median time to failure vs. data rate. Thus the proposed interconnect scheme which utilizes continuous wave VCSELs that are externally modulated by on-chip multiple quantum well modulators is applicable for chip-to-chip optical interconnects at 20  Gbit/sec⁡ and higher line data rates.

Paper Details

Date Published: 6 April 2012
PDF: 10 pages
Opt. Eng. 51(4) 045401 doi: 10.1117/1.OE.51.4.045401
Published in: Optical Engineering Volume 51, Issue 4
Show Author Affiliations
Rohit Nair, Univ. of Delaware (United States)
Keith W. Goossen, Univ. of Delaware (United States)
Michael W. Haney, Univ. of Delaware (United States)


© SPIE. Terms of Use
Back to Top