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Optical Engineering

Dual-prism coupler for board-level free-space optical interconnects: design and simulations
Author(s): Rohit Nair; Keith W. Goossen; Michael W. Haney
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Paper Abstract

An optical design for coupling light from off-chip lasers to on-chip surface-normal modulators is proposed in order to implement chip-to-chip free-space optical interconnects. The method uses a dual-prism module constructed from prisms made of two different glasses. The various alignment tolerances of the proposed system were investigated. For the off-chip lasers, vertical cavity surface emitting lasers (VCSEL) are proposed. The rationale behind using on-chip modulators rather than VCSELs is to avoid VCSEL thermal loads on the chip, and because of higher reliability of modulators than VCSELs. Particularly above 10  Gbit/sec (Gbit/sec⁡), an empirical model shows rapid decrease of VCSEL median time to failure vs. data rate. Thus the proposed interconnect scheme which utilizes continuous wave VCSELs that are externally modulated by on-chip multiple quantum well modulators is applicable for chip-to-chip optical interconnects at 20  Gbit/sec⁡ and higher line data rates.

Paper Details

Date Published: 6 April 2012
PDF: 10 pages
Opt. Eng. 51(4) 045401 doi: 10.1117/1.OE.51.4.045401
Published in: Optical Engineering Volume 51, Issue 4
Show Author Affiliations
Rohit Nair, Univ. of Delaware (United States)
Keith W. Goossen, Univ. of Delaware (United States)
Michael W. Haney, Univ. of Delaware (United States)

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