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Journal of Applied Remote Sensing • Open Access

Rigorous procedure for mapping thermal infrared images on three-dimensional models of building façades
Author(s): Mattia Previtali; Luigi Barazzetti; Veronica Redaelli; Marco Scaioni; Elisabetta Rosina

Paper Abstract

A rigorous methodology for mapping thermal and RGB images on three-dimensional (3-D) models of building façades is presented. The developed method differs from most existing approaches because it relies on the use of thermal images coupled with 3-D models derived from terrestrial laser scanning surveying. The primary issue for an accurate texturing is the coregistration of the geometric model of the façade and the thermal images in the same reference system. This task is done by using a procedure standing out from other approaches adopted in current practice, which are mainly based on the independent registration of each image on the basis of homography or space resection techniques. A rigorous photogrammetric orientation of both thermal and RGB images is computed together in a combined bundle adjustment. This solution allows one to have a better control of the quality of the results, especially to reduce errors and artifacts in areas where more images are mosaicked onto the 3-D model. Several products can be obtained: 3-D triangulated textured models or raster products like orthophotos, having the temperature as radiometric value. The proposed approach is tested on different buildings of Politecnico di Milano University. Applications demonstrated the performance of the procedure and its technical applicability in routine thermal surveys.

Paper Details

Date Published: 20 September 2013
PDF: 20 pages
J. Appl. Remote Sens. 7(1) 073503 doi: 10.1117/1.JRS.7.073503
Published in: Journal of Applied Remote Sensing Volume 7, Issue 1
Show Author Affiliations
Mattia Previtali, Politecnico di Milano (Italy)
Luigi Barazzetti, Politecnico di Milano (Italy)
Veronica Redaelli, Univ. degli Studi di Milano (Italy)
Marco Scaioni, Tongji Univ. (China)
Elisabetta Rosina, Politecnico di Milano (Italy)

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