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Journal of Photonics for Energy

High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes
Author(s): Che-Hsuan Huang; Kuo-Ju Chen; Ming-Ta Tsai; Min-Hsiung Shih; Chia-Wei Sun; Wei-I Lee; Chien-Chung Lin; Hao-Chung Kuo
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Paper Abstract

This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

Paper Details

Date Published: 21 April 2015
PDF: 9 pages
J. Photon. Energy 5(1) 057606 doi: 10.1117/1.JPE.5.057606
Published in: Journal of Photonics for Energy Volume 5, Issue 1
Show Author Affiliations
Che-Hsuan Huang, National Chiao Tung Univ. (Taiwan)
Kuo-Ju Chen, National Chiao Tung Univ. (Taiwan)
Ming-Ta Tsai, National Chiao Tung Univ. (Taiwan)
Min-Hsiung Shih, National Chiao Tung Univ. (Taiwan)
Academia Sinica (Taiwan)
Chia-Wei Sun, National Chiao Tung Univ. (Taiwan)
Wei-I Lee, National Chiao Tung Univ. (Taiwan)
Chien-Chung Lin, National Chiao Tung Univ. (Taiwan)
Hao-Chung Kuo, National Chiao Tung Univ. (Taiwan)

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