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Journal of Micro/Nanolithography, MEMS, and MOEMS

Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition
Author(s): Anuja De Silva; Indira Seshadri; Kisup Chung; Abraham Arceo; Luciana Meli; Brock Mendoza; Yasir Sulehria; Yiping Yao; Madhana Sunder; Hoa Truong; Shravan Matham; Ruqiang Bao; Heng Wu; Nelson M. Felix; Sivananda Kanakasabapathy
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Paper Abstract

With the increasing prevalence of complex device integration schemes, trilayer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination and are limited in their ability to scale down thickness without compromising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO 2 films with wet etch tunability. This paper presents a systematic study on development and characterization of plasma-enhanced atomic layer deposited (PEALD) TiO 2 -based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a trilayer scheme patterned with PEALD-based TiO 2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited versus a spin-on metal hardmask.

Paper Details

Date Published: 23 May 2017
PDF: 8 pages
J. Micro/Nanolith. MEMS MOEMS 16(2) 023504 doi: 10.1117/1.JMM.16.2.023504
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 16, Issue 2
Show Author Affiliations
Anuja De Silva, IBM Corp. (United States)
Indira Seshadri, IBM Corp. (United States)
Kisup Chung, IBM Corp. (United States)
Abraham Arceo, IBM Corp. (United States)
Luciana Meli, IBM Corp. (United States)
Brock Mendoza, IBM Corp. (United States)
Yasir Sulehria, IBM Corp. (United States)
Yiping Yao, IBM Corp. (United States)
Madhana Sunder, IBM Corp. (United States)
Hoa Truong, IBM Research - Almaden (United States)
Shravan Matham, IBM Corp. (United States)
Ruqiang Bao, IBM Corp. (United States)
Heng Wu, IBM Corp. (United States)
Nelson M. Felix, IBM Corp. (United States)
Sivananda Kanakasabapathy, IBM Corp. (United States)

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