Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references
Author(s): George Xereas; Vamsy P. Chodavarapu
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

We present the design and development of breath-mode silicon ring resonators fabricated using a commercial pure-play microfabrication process that provides ultraclean wafer-level vacuum-encapsulation. The micromechanical resonators are fabricated in MEMS integrated design for inertial sensors process that is developed by Teledyne DALSA Semiconductor Inc. The ring resonators are designed to operate with a relatively low DC polarization voltage, starting at 5 V, while providing a high frequency-quality factor product. We study the quality of the vacuum packaging using an automated testing setup over an extended time period. We study the effect of motional resistance on the performance of MEMS resonators. The fabricated devices had a resonant frequency of 10 MHz with the quality factor exceeding 8.4×104.

Paper Details

Date Published: 9 September 2016
PDF: 9 pages
J. Micro/Nanolith. MEMS MOEMS 15(3) 035004 doi: 10.1117/1.JMM.15.3.035004
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 3
Show Author Affiliations
George Xereas, McGill Univ. (Canada)
Vamsy P. Chodavarapu, Univ. of Dayton (United States)
McGill Univ. (United States)

© SPIE. Terms of Use
Back to Top