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Journal of Micro/Nanolithography, MEMS, and MOEMS

Direct hot embossing of microelements by means of photostructurable polyimide
Author(s): Meriem Akin; Maher Rezem; Maik Rahlves; Kevin Cromwell; Bernhard Roth; Eduard Reithmeier; Marc C. Wurz; Lutz Rissing; Hans Juergen Maier
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Paper Abstract

While automatic hot embossing systems are available for large- and small-scale productions of polymeric devices, one of the process challenges remains to be the manufacturing of precise, durable, and yet inexpensive hot embossing stamps. The use of metallic stamps manufactured by electroplating a photoresist pattern or by precision milling and their replication into silicone molds with UV-lithography, electroplating, and molding techniques is state of the art. Yet, there have been few, if any, thriving attempts to directly emboss polymers by means of bare photoresists, and in particular polyimide-based photoresists, without transferring the photoresist patterns into a different stamp material. We conduct a proof-of-concept by developing hot embossing stamps based on photosensitive polyimide. We focus primarily on the reliability of the aforementioned stamps throughout the hot embossing cycle and the fidelity of pattern transfer onto polymeric films for different microstructural patterns.

Paper Details

Date Published: 23 August 2016
PDF: 8 pages
J. Micro/Nanolith. MEMS MOEMS 15(3) 034506 doi: 10.1117/1.JMM.15.3.034506
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 3
Show Author Affiliations
Meriem Akin, Leibniz Univ. Hannover (Germany)
Maher Rezem, Leibniz Univ. Hannover (Germany)
Maik Rahlves, Leibniz Univ. Hannover (Germany)
Kevin Cromwell, Laser Zentrum Hannover e.V. (Germany)
Bernhard Roth, Leibniz Univ. Hannover (Germany)
Eduard Reithmeier, Leibniz Univ. Hannover (Germany)
Marc C. Wurz, Leibniz Univ. Hannover (Germany)
Lutz Rissing, Leibniz Univ. Hannover (Germany)
Hans Juergen Maier, Leibniz Univ. Hannover (Germany)

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