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Journal of Micro/Nanolithography, MEMS, and MOEMS

High aspect ratio patterning of photosensitive polyimide with low thermal expansion coefficient and low dielectric constant
Author(s): Andrew R. Dick; William K. Bell; Brendan Luke; Erin Maines; Brennen Mueller; Brandon Rawlings; Paul A. Kohl; C. Grant Willson
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Paper Abstract

A photosensitive polyimide system based on amine catalyzed imidization of a precursor poly(amic ester) is described. The material is based on the meta ethyl ester of pyromellitic dianhydride and 2,2’ bis(trifluoromethyl)benzidine. It acts as a negative tone resist when formulated with a photobase generator. The material exhibits a dielectric constant of 3.0 in the gigahertz range, a coefficient of thermal expansion of 6±2  ppm/K, and can be patterned to aspect ratios of >2 when formulated with a highly quantum efficient cinnamide type photobase generator.

Paper Details

Date Published: 26 July 2016
PDF: 9 pages
J. Micro/Nanolith. 15(3) 033503 doi: 10.1117/1.JMM.15.3.033503
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 3
Show Author Affiliations
Andrew R. Dick, The Univ. of Texas at Austin (United States)
William K. Bell, The Univ. of Texas at Austin (United States)
Brendan Luke, The Univ. of Texas at Austin (United States)
Erin Maines, The Univ. of Texas at Austin (United States)
Brennen Mueller, Georgia Institute of Technology (United States)
Brandon Rawlings, Intel Corp. (United States)
Paul A. Kohl, Georgia Institute of Technology (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)


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