Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Thick-film MEMS thermoelectric sensor fabricated using a thermally assisted lift-off process
Author(s): Yuan Jia; Haogang Cai; Qiao Lin
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

This paper presents a thick-film microelectromechanical systems thermoelectric sensor fabricated by a low-temperature thermally assisted lift-off process. During the process, thick metal or semiconductor films experience controlled breakup due to thermal reflow of the underlying lithographically defined photoresist patterns, thereby facilitating the sacrificial removal of the photoresist. This enables rapid and reliable patterning of thick films that can otherwise be difficult to achieve by conventional processes. Experimental results with a sensor consisting of a 60-junction thick-film antimony–bismuth thermopile demonstrate an electric conductivity of 5.44×106  S/m and a Seebeck coefficient of 114  μV/K per junction, which are comparable to those obtained from bulk materials. Thus, the thick-film sensor can potentially allow low-noise, high-efficiency thermoelectric measurements.

Paper Details

Date Published: 9 June 2016
PDF: 5 pages
J. Micro/Nanolith. MEMS MOEMS 15(2) 024501 doi: 10.1117/1.JMM.15.2.024501
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 2
Show Author Affiliations
Yuan Jia, Columbia Univ. (United States)
Haogang Cai, Columbia Univ. (United States)
Qiao Lin, Columbia Univ. (United States)

© SPIE. Terms of Use
Back to Top