
Journal of Micro/Nanolithography, MEMS, and MOEMS
Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut processFormat | Member Price | Non-Member Price |
---|---|---|
$20.00 | $25.00 |
![]() |
GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. | Check Access |
Paper Abstract
LELECUT type triple patterning lithography is one of the most promising techniques in 14 nm logic node and beyond. To prevent yield loss caused by overlay error, LELECUT mask assignment, which is tolerant to overlay error, is desired. We propose a method that obtains a LELECUT assignment that is tolerant to overlay error. The proposed method uses positive semidefinite relaxation and randomized rounding technique. In our method, the cost function that takes the length of boundary of features determined by the cut mask into account is introduced.
Paper Details
Date Published: 11 March 2016
PDF: 7 pages
J. Micro/Nanolith. MEMS MOEMS 15(2) 021207 doi: 10.1117/1.JMM.15.2.021207
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 2
PDF: 7 pages
J. Micro/Nanolith. MEMS MOEMS 15(2) 021207 doi: 10.1117/1.JMM.15.2.021207
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 15, Issue 2
Show Author Affiliations
Yukihide Kohira, Univ. of Aizu (Japan)
Chikaaki Kodama, Toshiba Corp. (Japan)
Tomomi Matsui, Tokyo Institute of Technology (Japan)
Chikaaki Kodama, Toshiba Corp. (Japan)
Tomomi Matsui, Tokyo Institute of Technology (Japan)
Atsushi Takahashi, Tokyo Institute of Technology (Japan)
Shigeki Nojima, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
Shigeki Nojima, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
© SPIE. Terms of Use
