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Journal of Micro/Nanolithography, MEMS, and MOEMS • Open Access

Fabrication of high-aspect ratio silicon nanopillars for tribological experiments
Author(s): Pavlo V. Antonov; Marc R. Zuiddam; Joost W. M. Frenken

Paper Abstract

This article reports the results of the fabrication of large arrays of nanopillars for future tribological experiments. This fabrication focused on achieving a constant high aspect ratio up to 1∶24 and a separation between each pair of adjacent pillars. Electron beam lithography was used to write patterns in hydrogen silsesquioxane (HSQ) negative tone resist. To achieve nanopillars of high aspect ratios and with smooth sides, deep reactive ion etching was employed with SF6 and O2 at cryogenic temperatures. Finally, the residual HSQ was removed using CHF3/O2 plasma etching in order to obtain a smooth finish.

Paper Details

Date Published: 10 December 2015
PDF: 4 pages
J. Micro/Nanolith. 14(4) 044506 doi: 10.1117/1.JMM.14.4.044506
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 14, Issue 4
Show Author Affiliations
Pavlo V. Antonov, Leiden Univ. (The Netherlands)
Advanced Research Ctr. for Nanolithography (The Netherlands)
Marc R. Zuiddam, Technische Univ. Delft (The Netherlands)
Joost W. M. Frenken, Leiden Univ. (The Netherlands)
Advanced Research Ctr. for Nanolithography (The Netherlands)


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