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Journal of Micro/Nanolithography, MEMS, and MOEMS

Development of lossy and near-lossless compression methods for wafer surface structure digital holograms
Author(s): Hongbo Zhang; Wenjing Zhou; Donald E. Leber; Zhijuan Hu; Xin Yang; Peter W. M. Tsang; Ting-Chung Poon
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Paper Abstract

Lossy and near-lossless digital hologram compression methods are investigated to compress different complexities of wafer surface structures. In the lossy compression method, we apply row- and column-based uniform downsampling together with spline interpolation, whereas in the near-lossless compression method, we use wavelet local modulus maxima and spline interpolation. Results have shown that the lossy compression method is able to achieve a compression ratio of up to 100 for simpler wafer surface structures than that for complex surface structures. However, the near-lossless compression method is able to yield almost lossless compression even for complex wafer surface structures with a compression of about two. The proposed compression methods are computationally friendly for wafer surface structures as there is no time-consuming iterative computation involved.

Paper Details

Date Published: 3 August 2015
PDF: 8 pages
J. Micro/Nanolith. 14(4) 041304 doi: 10.1117/1.JMM.14.4.041304
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 14, Issue 4
Show Author Affiliations
Hongbo Zhang, Virginia Polytechnic Institute and State Univ. (United States)
Wenjing Zhou, Virginia Polytechnic Institute and State Univ. (United States)
Shanghai Univ. (China)
Donald E. Leber, Virginia Polytechnic Institute and State Univ. (United States)
Zhijuan Hu, Shanghai Normal Univ. (China)
Xin Yang, Soochow Univ. (China)
Peter W. M. Tsang, City Univ. of Hong Kong (China)
Ting-Chung Poon, Virginia Polytechnic Institute and State Univ. (United States)


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