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Journal of Micro/Nanolithography, MEMS, and MOEMS

Bonding of copper surface in ambient air using propylene carbonate as passivation layer
Author(s): Zhiyuan Zhu; Min Yu; Oluwadamilola Phillips; Lisha Liu; Yufeng Jin
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Paper Abstract

Bonding of a copper surface in a nonvacuum environment has been studied for the purpose of reducing manufacturing costs. Cu-Cu bonding in ambient air is demonstrated by using propylene carbonate (PPC) as a passivation layer. The decomposition of the PPC passivation layer during bonding would protect the copper surface from oxidation by providing a shielding gas atmosphere between the copper surface and the air. Further, the PPC passivation layer would also overcome the degradation of copper surface during storage in the atmosphere.

Paper Details

Date Published: 25 September 2015
PDF: 5 pages
J. Micro/Nanolith. 14(3) 034504 doi: 10.1117/1.JMM.14.3.034504
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 14, Issue 3
Show Author Affiliations
Zhiyuan Zhu, Peking Univ. (China)
Georgia Institute of Technology (United States)
Min Yu, Peking Univ. (China)
Oluwadamilola Phillips, Georgia Institute of Technology (United States)
Lisha Liu, Georgia Institute of Technology (United States)
Yufeng Jin, Peking Univ. (China)


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