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Journal of Micro/Nanolithography, MEMS, and MOEMS

Application of E-beam hot spot inspection for early detection of systematic patterning problems to a FinFET technology
Author(s): Deborah A. Ryan; Oliver D. Patterson; Shuen-Cheng Lei; David Conklin; Jim Liang; Glenn Biery; Atsushi Ogino; Bachir Dirahoui; Zachary Baum; Michael D. Monkowski
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Paper Abstract

Early in-line detection of systematic patterning problems in technology development can dramatically improve a technology’s chance for success. By uncovering layout geometries that are difficult to implement, prompt action may be taken so that solutions are in place well before product chips that contain these and similar patterns enter the manufacturing line. If a solution is not in place, this could spell disaster for the product and perhaps even the technology. Ideally, product chips will work on the first lot, which is referred to as “first time right.” To help ensure this, a methodology for in-line detection of systematic patterning problems using E-beam hot spot inspection (EBHI) was developed. We review this methodology, including the latest enhancements. Pattern simulation tools and other sources are used to provide die locations with challenging geometries for evaluation. EBHI evaluates the patterning capability for these locations using modulated wafers. A multifunction team addresses any hot spots that fail within the process window. EBHI is then used to evaluate the solutions proposed by this team. Application of this methodology to a fin-shaped field effect transistor technology is described using examples from the fin and back end of line modules. These examples illustrate the full range of actions used to resolve patterning issues.

Paper Details

Date Published: 13 May 2015
PDF: 7 pages
J. Micro/Nanolith. 14(2) 021106 doi: 10.1117/1.JMM.14.2.021106
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 14, Issue 2
Show Author Affiliations
Deborah A. Ryan, IBM Corp. (United States)
Oliver D. Patterson, IBM Corp. (United States)
Shuen-Cheng Lei, Hermes-Microvision Inc., USA (United States)
David Conklin, IBM Corp. (United States)
Jim Liang, IBM Corp. (United States)
Glenn Biery, IBM Corp. (United States)
Atsushi Ogino, IBM Corp. (United States)
Bachir Dirahoui, IBM Corp. (United States)
Zachary Baum, IBM Corp. (United States)
Michael D. Monkowski, IBM Corp. (United States)


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