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Journal of Micro/Nanolithography, MEMS, and MOEMS

Exploiting sub-20-nm complementary metal-oxide semiconductor technology challenges to design affordable systems-on-chip
Author(s): Kaushik Vaidyanathan; Qiuling Zhu; Lars Liebmann; Kafai Lai; Stephen Wu; Renzhi Liu; Yandong Liu; Andzrej Strojwas; Larry Pileggi
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Paper Abstract

For the past four decades, cost and features have driven complementary metal-oxide semiconductor (CMOS) scaling. Severe lithography and material limitations seen below the 20-nm node, however, are challenging the fundamental premise of affordable CMOS scaling. Just continuing to co-optimize leaf cell circuit and layout designs with process technology does not enable us to exploit the challenges of sub-20-nm CMOS. For affordable scaling, it is imperative to work past sub-20-nm technology impediments while exploiting its features. To this end, we propose to broaden the scope of design technology co-optimization (DTCO) to be more holistic by including microarchitecture design and computer-aided design, along with circuits, layout, and process technology. Furthermore, we undertook such a holistic DTCO for all critical design elements such as embedded memory, standard cell logic, analog components, and physical synthesis in a 14-nm process. Measurements results from experimental designs in a representative 14-nm process from IBM demonstrate the efficacy of the proposed approach.

Paper Details

Date Published: 30 December 2014
PDF: 17 pages
J. Micro/Nanolith. MEMS MOEMS 14(1) 011007 doi: 10.1117/1.JMM.14.1.011007
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 14, Issue 1
Show Author Affiliations
Kaushik Vaidyanathan, Carnegie Mellon Univ. (United States)
Qiuling Zhu, Carnegie Mellon Univ. (United States)
Lars Liebmann, IBM Corp. (United States)
Kafai Lai, IBM Corp. (United States)
Stephen Wu, IBM Corp. (United States)
Renzhi Liu, Carnegie Mellon Univ. (United States)
Yandong Liu, IBM Corp. (United States)
Andzrej Strojwas, Carnegie Mellon Univ. (United States)
Larry Pileggi, Carnegie Mellon Univ. (United States)

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