Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Assessment of critical dimension small-angle x-ray scattering measurement approaches for FinFET fabrication process monitoring
Author(s): Charles M. Settens; Aaron Cordes; Benjamin D. Bunday; Abner F. Bello; Vimal K. Kamineni; Abhijeet Paul; Jody Fronheiser; Richard J. Matyi
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We have used synchrotron-based critical dimension small-angle x-ray scattering (CD-SAXS) to monitor the impact of hydrogen annealing on the structural characteristics of silicon FinFET structures fabricated using self-aligned double patterning on both bulk silicon and silicon-on-insulator (SOI) substrates. H2 annealing under different conditions of temperature and gas pressure allowed us to vary the sidewall roughness and observe the response in the two metrology approaches. In the case of the simpler bulk Si FinFET structures, the CD-SAXS measurements of the critical dimensions are in substantive agreement with the top–down critical dimension scanning electron microscopy metrology. Corresponding characterizations on SOI-based FinFET structures showed less agreement, which is attributed to the more complex structural model required for SOI FinFET CD-SAXS modeling. Because sidewall roughness is an important factor in the performance characteristics of Si FinFETs, we have compared the results of roughness measurements using both critical dimension atomic force microscopy (CD-AFM) and CD-SAXS. The measurements yield similar estimates of sidewall roughness, although the CD-AFM values were typically larger than those generated by CD-SAXS. The reasons for these differences will be discussed.

Paper Details

Date Published: 4 November 2014
PDF: 10 pages
J. Micro/Nanolith. 13(4) 041408 doi: 10.1117/1.JMM.13.4.041408
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 13, Issue 4
Show Author Affiliations
Charles M. Settens, SUNY College of Nanoscale Science and Engineering (United States)
Sematech (United States)
Aaron Cordes, SEMATECH Inc. (United States)
Benjamin D. Bunday, SEMATECH Inc. (United States)
Abner F. Bello, GLOBALFOUNDRIES Inc. (United States)
Vimal K. Kamineni, GLOBALFOUNDRIES Inc. (United States)
Abhijeet Paul, GLOBALFOUNDRIES Inc. (United States)
Jody Fronheiser, GLOBALFOUNDRIES Inc. (United States)
Richard J. Matyi, SUNY College of Nanoscale Science and Engineering (United States)

© SPIE. Terms of Use
Back to Top